SemiTool
Home Our Story Our Products Investors News & Events Support Contact Us Search
Welcome to Semitool’s archive of technical publications. Semitool engineers are encouraged to share their knowledge with the public by publishing papers and speaking at conferences and symposia. This archive of technical papers represents the wide range of Semitool’s expertise and innovation, and reflects our goal to be a world leader in the semiconductor industry with ‘technology that works’. These are public-domain papers authored or co-authored by Semitool employees and some of our technology partners. Links to the most recent technical papers are listed below by publication date.

COMPANY OVERVIEW

SEMITOOL, an innovator in the semiconductor industry

TECHNICAL PUBLICATIONS

Selected publication by Semitool and partners

CAREERS

Fast paced technology leader with a fisherman's flare. Consider Semitool for a career/adventure.
ECD

SEED ENHANCEMENT: A BRIDGING TECHNOLOGY

Future Fab International - France
View PDF File »
June 2005Author(s):

Dr. Paul-Henri Haumesser
Anne Roule
Dr. Sylvain Maitrejean
Dr. Gerard Passemard

CEA-Leti
CEA-Leti
CEA-Leti
STMicroelectronics

 

DESIGN AND MODELING OF EQUIPMENT USED IN ELECTROCHEMICAL PROCESSES FOR MICROELECTRONICS

IBM Journal of Microelectronics
View PDF File »
January 2005Author(s):
Thomas L. Ritzdorf
Gregory J. Wilson
Paul R. McHugh
Daniel J. Woodruff
Kyle M. Hanson
Dakin Fulton

SEMITOOL

 

UNSTEADY NUMERICAL SIMULATION OF THE MASS TRANSFER WITHIN

ECS San Antonio Texas
View PDF File »
May 2004Author(s):
Gregory J. Wilson
Paul R. McHugh
SEMITOOL
 

TWO-STEP ROOM TEMPERATURE GRAIN GROWTH IN ELECTROPLATED COPPER

Journal of Applied Physics Vol. 86(7) pp. 3642-3645
View PDF File »
December 1999Author(s):
S. H. Brongersma
E. Richard
I. Vervoort
H. Bender
W. Vandervorst
G. Beyer
K. Maex
S. Lagrange

IMEC
IMEC
IMEC
IMEC
IMEC
INSYS, K. U.
INSYS, K. U.
Semitool, Inc.

 
Packaging

EMC3D CONSORTIUM CREATED FOR THE DEVELOPMENT OF COST-EFFECTIVE

February 2007Author(s):
Bioh Kim
SEMITOOL
 

LOW COST, HIGH RELIABILITY ELECTROPLATING WLP TECHNOLOGY INTEGRATION OF SNAG CHIP TO CHIP INTERCONNECT

Tokyo, Japan
View PDF File »
December 2006Author(s):
Paul Siblerud
SEMITOOL
 

COMPARISON OF NEAR-EUTECTIC SNPB AND SNAG SOLDER PLATING

January 2006Author(s):

Bioh Kim
Charles Sharbono
Tom Ritzdorf
Dan Schmauch

SEMITOOL
 

FACTORS LIMITING THE ELECTRODEPOSITION RATE OF VARIOUS BUMPS

Scottsdale Arizona
View PDF File »
March 2005Author(s):
Bioh Kim
Bob Batz
Tom Ritzdorf
SEMITOOL
 

THROUGH-MASK ELECTRODEPOSITION OF LEADFREE SOLDERS

October 2004Author(s):
Bioh Kim
Tom Ritzdorf
Dan Schmauch
Paul Siblerud
SEMITOOL
 

ELECTRICAL WAVEFORM MEDIATED THROUGH-MASK DEPOSITION

ECS Spring 04
View PDF File »
April 2004Author(s):
Bioh Kim
Tom Ritzdorf
SEMITOOL
 

UBM ETCH, USING WET CHEMISTRY FOR ETCHING UNDER-BUMP METAL

October 2001Author(s):

Marvin Bernt
Gary Solomon
Ed Dirks

SEMITOOL
 
Surface Prep

EVALUATION OF UNDERCUT AND APPLICABILITY OF A BATCH HF VAPOR ETCHING SYSTEM IN

September 2004Author(s):
John Tolomei
Bob Timon
Eric Bergman

Sandia National Labs
Sandia National Labs
SEMITOOL

 

CHARACTERIZATION OF A BATCH HF VAPOR PROCESSOR FOR MEMS

September 2004Author(s):
Julien Chiaroni
Hubert Grange
Olivier Pollet
Eric Bergman

LETI-CEA Grenoble
LETI-CEA Grenoble
SEMITOOL
SEMITOOL

 
A Production of SnowDog Web Development, Inc.