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Raider ECD

The RAIDER electroplating systems for 150mm - 300mm single wafer, automated, multi-chamber, electrochemical deposition system delivering the highest throughput in the smallest footprint available

Raider SP

Fourth generation single wafer, precision, high volume surface preparation system, incorporating spray, vapor, immersion, megasonics and anneal technologies with automated single or dual-side wafer processing.

Spin Rinser Dryer (SRD)

The SRD is a 25-wafer, batch size, single or dual chamber tool.  This proven design has demonstrated uptime of >95%.  Introduced in 1979, over 25,000 Spin Rinser/Dryer units have shipped worldwide.

ACMS

Advanced Chemical Management System automatically monitors and replenishes the constituents of electrolyte plating baths of up to four Semitool ECD tools.

Raider M

The RAIDER M (Mini) is a fully automated, 2 chamber, high-performance single-wafer ECD system.  Ideal for product development and pilot production.

Equinox 1st Generation Single Wafer Tool

SEMITOOL builds Equinox platforms in 4 and 6 chamber versions and are available both new, direct from SEMITOOL, and remanufactured by Rhetech.

AcceleRAIDER

A Raider tool with enhanced automation to run volumes in excess of 400 wafers per hour

Sirius

Sirius is a batch 50-Wafer, single chamber, ozone and water chemical-free resist stripper with high-performance stipping, rinsing and drying.

Scepter Rinser Dryer

Batch 50-wafer, single chamber, high-performance rinsing and drying. First introduced in 1979, there are over 28,000 Spin Rinser/Dryer units shipped worldwide.

Scepter Solvent

Batch, semi-automated 50-wafer, single or double chamber stripping, developing, and cleaning spray solvent tool. 

Spectrum

Automated batch wafer chemical system for high volume manufacturing

Spray Solvent Tool (SST)

Batch, semi-automated 25-wafer, single or double chamber chemical stripping, developing, and cleaning spray solvent tool. Over 1,200 SST chambers have been installed worldwide in Asia, Europe and the United States.

Spray Acid Tool (SAT)

Batch, semi-automated 25-wafer, single or double chamber chemical cleaning, stripping, etching, and spray acid tool.

Storm

Storm II, Storm III, Storm 300 for batch cleaning system for dry to dry cassette cleaners for carriers, 300mm FOUPs, FOSBs, and Shippers. 

Raider M-Quattro

The Raider M-Quattro is a high-performance single-wafer system for electroplating or cleaning.  Developed for low volume fabs, this four-chamber system is the smallest most cost effective precision tool

Raider M-ECD/SP

The Raider M-ECD/SP is an automated, high-performance single-wafer ECD or Surface Preparation system.

Scepter Acid Tool

The semi-automated Scepter Acid Tool is a cost-effective solution for a wide array of surface preparation processes.

Back Side Films Etch
Back Side Metals Clean
Container Dry to Dry Clean
Copper Anneal In-situ
Copper Damascene Plate
Cu Back Side and Bevel Etch
GaAs Clean
GaAs Etch (Gate Recess Etch)
Gold ECD
Gold Electro Etch
HF Vapor Etch
High K Wafer Clean, Back and Bevel
Lead Free Bumping
Metal Lift-off
Metals Etch
Nickel ECD
NiPt Unreacted Silicide Strip
Oxide Etch
Oxide-Nitride-Oxide (ONO Etch)
Patterned Copper ECD
Permalloy ECD
Photoresist Removal BEOL
Photoresist Stripping FEOL
Platinum ECD
Post Ash Cleans
Post CMP Clean
Post Etch Residue (Polymer Removal)
Pre-Deposition (Pre-Gate)
Pre-Diffusion Clean (Pre-epi)
Pre-Epi LTO Oxide Removal
Pre-Photo Lithography Cleans
Spray Clean (SRD) Spin-Rinse-Dry
Tantalum Anodization (High k)
Thin Film Heads (GMR)
TSV Copper
Under Bump Metallurgy (UBM Etch)
Wafer Level Packaging - Solder ECD
Wafer Reclaim (Cu rework)
ECD Seed - Enhance or DOB
EMC-3D for Wafer Level Chip Stacking
Copper RDL and Pillar
HydrOzone Clean
FluorOzone Clean
P4 Surface Preparation BEOL cleans
Copper Interconnect
FEOL Surface Preparation