Wednesday - June 25, 2008
7:00 AM	Breakfast
7:55 AM	Introduction
8:00 AM	Keynote - Conference Room
	Electrochemical Processing in the Semiconductor Industry Rajesh Krishnamurthy - ChipWorks
	COPPER INTERCONNECTS - Session Chair: Klaus Pfeifer
8:45 AM	Cu-Based ULSI Interconnect Technologies Invited: Dan Edelstein - IBM
9:30 AM	Effects of Mass Transport and Macromolecular Additives on Copper Electrodeposit Microroughness Michael L. Free, Ravindra Bhide, and Apichart Rodchanarowan - University of Utah, Dept. of Metallurgical Engineering
9:55 AM	Break
10:25 AM	Influence of Plating Chemistry and Current Waveform on the Film Properties of Cu Interconnects Qi Wang, Patrick Cheung, Wesley Cabreros, Kashmir Sahota - Spansion Inc.
10:50 AM	Interaction of Barrier Seed Surface Contamination with Electro-Deposition Copper Films Frank Smith, Sai Boyapati, Bill Brennan, Kinsang Lam, Pete Beckage, Brad Carpenter, and Brandon Brooks – Spansion, Semitool
11:30 AM	Lunch
	PROPERTIES OF ELECTROCHEMICALLY PROCESSED FILMS - Session Chair: Kevin Mikelson
1:30 PM	A Novel Method For Isolating Electrodeposited Films Nikit Phadke and Michael L. Free - University of Utah, Department of Metallurgical Engineering
1:55 PM	Some Peculiarities Of Nature Of Reverse Bias Electrical Conductivity Of Niobium Pentoxide Anodic Oxide Films In Capacitor Structure On Niobium Leonid SKATKOV, Valeriy GOMOZOV, Irina STEPANOVA, Svetlana DERIBO – PCB(Israel) and National Technical Universitet, Ukraine
2:20 PM	Development of Low Stress Binary and Tertiary High-Magnetic Flux Alloy films from Electrolytic Solutions W. Graham Yelton, and Adam Rowen - Sandia National Labs
2:45 PM	Break
3:15 PM	3D Interconnect Plating and Stacking Charles Wu - Micron
3:40 PM	Electroless Nickel/Palladium/Gold As Universal Surface Finish For Soldering/ Bonding Application In Semiconductor Industry Dr. Albrecht Uhlig, Dr. Lilly Tsai, J. Gaida, A. Taniguchi – Atotech
5:00 PM	Dinner in Bigfork, MT