| Thursday, June 26, 2008 | |
| 7:00 AM | Breakfast |
| 8:00 AM | Introduction |
ALLOY PLATING AND CHIP PACKAGING APPLICATIONS - Session Chair: Dan Schmauch |
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| 8:05 AM | The Application of Self Assembled Nanolayers to Precious Metals Electroplated Deposits Joe Abys, Ed Kudrak, Shenliang Sun, Ted Antonellis - Cookson Electronics Enthone Inc. |
| 8:50 AM | Chemical and Electrical Methods of Inducing Shape Change in Electroplated Wafer Structures Eric Huenger, Eric Chiu, Bob Forman - Rohm and Haas |
| 9:15 AM | All-Copper Substrate Connections (Is There Life Without Solder?) Paul A. Kohl, Tyler Osborn, Charles Lightsey - Georgia Institute of Technology |
| 9:40 AM | Drivers for TSV Technology E. Jan Vardaman - TechSearch International |
| 10:05 AM | TSVs are More than Moore for Memory Application Kyle Kirby - Micron Technology |
| 10:30 AM | Break |
| 10:45 AM | High-Speed Indium Electroplating: New Technology for Thermal Management and Interconnect Edit Szöcs, Felix Schwager, Michael Toben, Martin Bayes, Nate Brese – Rohm and Haas |
| 11:10 AM | The Electrodeposition of Eutectic Gold-Tin Alloy for Fluxless Soldering Applications George Hradil - Technic |
| 11:35 AM | Electroforming Bi(1-x)Sb(x) Nanowires for High-Efficiency On-Chip Thermoelectric Cooling W. Graham Yelton and Michael P. Siegal - Sandia National Labs, Jennifer Keyani and Angelica M. Stacy - Department of Chemistry, University of California, Berkeley CA |
| 12:00 PM | Lunch |
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POSTER SESSION |
| 5:00 PM | "The Wings of Freedom Tour" - View Collings Foundation WWII Planes |
| 6:00 PM | Dinner - Semitool Hangar (Glacier Park International Airport) |