Hilton Garden Inn
Kalispell, Montana USA
This is the third PEAKS symposium on Electrochemical Processes for Microelectronics and the seventh in a series of PEAKS technology symposiums that have also included topics on Wafer Level Packaging.
This symposium will feature presentations of invited and regular papers from academia and the industry, and will focus on technical innovations and research while providing you the time and opportunity to share challenges, theorize on new methods, collaborate with equipment manufacturers, universities, and suppliers, and have a little fun in Montana.
TOPICS
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Copper Interconnects |
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Electroless Deposition Processes |
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Alloy Plating and Chip Packaging Applications |
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Chemical Analysis of Electrolytes |
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Electrochemical Alloy Deposition in MEMS and Packaging Processes |
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Novel Applications of Electrochemical Processing |
FUN ACTIVITIES!
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Tuesday, June 24, 2008 - 6:00 PM Opening Dinner | |
Guest Speaker: Kate Kendall, US Geological Service |
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Thursday, June 26, 2008 |
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| Glacier Park International Airport “Wings of Freedom Tour” and Dinner The Ultimate Living History Experience! Chance to win a 30-minute ride in one of the WWII bombers |
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Friday, June 27, 2008 - Glacier National Park |
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| BBQ and Red "Jammer" Bus Tour Lunch along the shore of beautiful Lake McDonald, then a Red Bus tour to the North American Continental Divide. |
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