Please direct inquiries to:
peaks@semitool.com

Tom Ritzdorf
(406) 758-7502
  or  
Terri Kissane
(406) 758-7522

Call For Papers

ACCEPTING ABSTRACTS

(Printable Version)

Submit one original, properly formatted, abstract either electronically or on paper to:

Semitool, Inc.
ATTN: Terri Kissane
655 W. Reserve Drive
Kalispell, MT 59901 USA
email: peaks@semitool.com

This PEAKS plating symposium is soliciting abstracts on electrochemical processing for microelectronic applications. Abstracts should explicitly state objectives, new results, and conclusions or significance of the work. Some papers will be scheduled for poster presentation. All authors selected for either oral or poster presentations will be notified by April 15, 2008.

Abstracts should be no more than one page in length, one inch left and right margins, and single-spaced. The title should be centered, capitalized, and in bold face. The preferred font is 10pt, Times New Roman. Type author(s), affiliation(s), and address(es) centered below the title.

SUBJECTS OF INTEREST
— click here for PRESENTATION INSTRUCTIONS —

Copper Interconnect ECD Processes: Chemistry, Processes and Copper Interconnect Structures and Properties
Electroless Deposition: Selective Barrier Capping, Packaging Processes, Process Stability And Control
ECD Alloy Deposition: Electroless And Electrolytic Alloy Deposition, Magnetic Alloys, Solder Alloy Processes
Properties Of Electrochemically Deposited Materials: Stress, Crystallographic Texture, Mechanical Properties, Magnetic Properties And Their Relationship To Electrochemical Deposition Processes
Anodic Process: Anodization To Form High-K Dielectric Materials, Electrochemical Etching, Electrophoretic Deposition
Chemical Analysis Of Electrolytes: Electroanalytical Methods (CVS, PCGA, Etc.), Control Of Electrolyte Concentrations, Novel Analysis Methods, Measuring Additive Breakdown Products
Novel Applications Of Electrochemical Processing For Microelectronic Applications: Packaging, MEMS, Micro-Component Technology, Thin Film Heads
Modeling Of Electrochemical Processes: Fluid Flow, Potential Distributions, Reactor Scale, Feature Scale
Surface Electrochemistry: Atomic Layer Epitaxy, Self-Assembled Monolayers, Organic Additive Functionality
 
Sponsored by: Semitool, Inc. Co-Sponsored by: Semiconductor International The Electrochemical Society