| Tuesday, June 24, 2008 | |
| 4:00 PM | Registration and Conference Check-in Glacier Ballroom Foyer |
| 5:00 PM | Welcome Reception Glacier Ballroom Foyer |
| 6:00 PM | Dinner Ballroom |
| Guest Speaker: | |
| Kate Kendall - Project Coordinator United States Geological Service Northern Continental Divide Grizzly Bear Study - DNA, GPS, and statistics as they apply to grizzly bears |
|
Wednesday - June 25, 2008 |
|
| 7:00 AM | Breakfast |
| 7:55 AM | Introduction |
| 8:00 AM | Keynote - Conference Room |
| Electrochemical Processing in the Semiconductor Industry Rajesh Krishnamurthy - ChipWorks |
|
COPPER INTERCONNECTS - Session Chair: Klaus Pfeifer |
|
| 8:45 AM | Cu-Based ULSI Interconnect Technologies Invited: Dan Edelstein - IBM |
| 9:30 AM | Effects of Mass Transport and Macromolecular Additives on Copper Electrodeposit Microroughness Michael L. Free, Ravindra Bhide, and Apichart Rodchanarowan - University of Utah, Dept. of Metallurgical Engineering |
| 9:55 AM | Break |
| 10:25 AM | Influence of Plating Chemistry and Current Waveform on the Film Properties of Cu Interconnects Qi Wang, Patrick Cheung, Wesley Cabreros, Kashmir Sahota - Spansion Inc. |
| 10:50 AM | Interaction of Barrier Seed Surface Contamination with Electro-Deposition Copper Films Frank Smith, Sai Boyapati, Bill Brennan, Kinsang Lam, Pete Beckage, Brad Carpenter, and Brandon Brooks – Spansion, Semitool |
| 11:30 AM | Lunch |
PROPERTIES OF ELECTROCHEMICALLY PROCESSED FILMS - Session Chair: Kevin Mikelson |
|
| 1:30 PM | A Novel Method For Isolating Electrodeposited Films Nikit Phadke and Michael L. Free - University of Utah, Department of Metallurgical Engineering |
| 1:55 PM | Some Peculiarities Of Nature Of Reverse Bias Electrical Conductivity Of Niobium Pentoxide Anodic Oxide Films In Capacitor Structure On Niobium Leonid SKATKOV, Valeriy GOMOZOV, Irina STEPANOVA, Svetlana DERIBO – PCB(Israel) and National Technical Universitet, Ukraine |
| 2:20 PM | Development of Low Stress Binary and Tertiary High-Magnetic Flux Alloy films from Electrolytic Solutions W. Graham Yelton, and Adam Rowen - Sandia National Labs |
| 2:45 PM | Break |
| 3:15 PM | 3D Interconnect Plating and Stacking Charles Wu - Micron |
| 3:40 PM | Electroless Nickel/Palladium/Gold As Universal Surface Finish For Soldering/ Bonding Application In Semiconductor Industry Dr. Albrecht Uhlig, Dr. Lilly Tsai, J. Gaida, A. Taniguchi – Atotech |
| 5:00 PM | Dinner in Bigfork, MT |
Thursday, June 26, 2008 |
|
| 7:00 AM | Breakfast |
| 8:00 AM | Introduction |
ALLOY PLATING AND CHIP PACKAGING APPLICATIONS - Session Chair: Dan Schmauch |
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| 8:05 AM | The Application of Self Assembled Nanolayers to Precious Metals Electroplated Deposits Joe Abys, Ed Kudrak, Shenliang Sun, Ted Antonellis - Cookson Electronics Enthone Inc. |
| 8:50 AM | Chemical and Electrical Methods of Inducing Shape Change in Electroplated Wafer Structures Eric Huenger, Eric Chiu, Bob Forman - Rohm and Haas |
| 9:15 AM | All-Copper Substrate Connections (Is There Life Without Solder?) Paul A. Kohl, Tyler Osborn, Charles Lightsey - Georgia Institute of Technology |
| 9:40 AM | Drivers for TSV Technology E. Jan Vardaman - TechSearch International |
| 10:05 AM | TSVs are More Than Moore for Memory Application Kyle Kirby - Micron Technology |
| 10:30 AM | Break |
| 10:45 AM | High-Speed Indium Electroplating: New Technology for Thermal Management and Interconnect Edit Szöcs, Felix Schwager, Michael Toben, Martin Bayes, Nate Brese – Rohm and Haas |
| 11:10 AM | The Electrodeposition of Eutectic Gold-Tin Alloy for Fluxless Soldering Applications George Hradil - Technic |
| 11:35 AM | Electroforming Bi(1-x)Sb(x) Nanowires for High-Efficiency On-Chip Thermoelectric Cooling W. Graham Yelton and Michael P. Siegal - Sandia National Labs, Jennifer Keyani and Angelica M. Stacy - Department of Chemistry, University of California, Berkeley CA |
| 12:00 PM | Lunch |
|
POSTER SESSION |
| 5:00 PM | "The Wings of Freedom Tour" - View Collings Foundation WWII Planes |
| 6:00 PM | Dinner - Semitool Hangar (Glacier Park International Airport) |
Friday, June 27, 2008 |
|
| 7:45 AM | Breakfast |
| 8:45 AM | Introduction |
CHEMICAL ANALYSIS OF ELECTROLYTES - Session Chair: Shea Cordial |
|
| 8:50 AM | Analytics for Electroless Processes Jürg Stahl - Ancosys |
| 9:15 AM | Electrochemical Express Analysis of Copper Plating Processes used in Microelectronics Michael Pavlov, Eugene Shalyt and Peter Bratin - ECI Technology |
| 9:45 AM | Copper ECD Process Control By Means Of Electroanalysis Coupled With PARAllel FACtor Analysis (PARAFAC) Multi-Way Data Decomposition Chemometric Technique Aleksander Jaworski, Hanna Wikiel, and Kazimierz Wikiel - Technic, Inc. |
| 10:10 AM | Keep the Motor Running — Moore’s Law, 450mm, and How We Keep This Industry In Gear G. Dan Hutcheson - VLSI Research, Inc. |
| 10:35 AM | Conference Wrap-up |
| 11:30 AM | BBQ - Glacier National Park Fish Creek Picnic Area Red Bus Tours Depart from Village Inn at Apgar 2:00 PM |